Bokosi labwino kwambiri la Solderless Breadboard - bolodi, 236-M, 2390 malo opanda buledi opanda mkate - J-Guang

Bokosi labwino kwambiri la Solderless Breadboard - bolodi, 236-M, 2390 malo opangira mkate wopanda mafuta - J-Guang Chithunzi Chowonetsedwa

Kufotokozera Kwachidule:

Bolodi la mkate la J-GUANG lili ndi mitundu itatu: bolodi la mkate wopanda solder, losawoneka bwino, bolodi lophatikizika. Iwo ali kulongedza awiri: bokosi kulongedza ndi thireyi kulongedza katundu, tikhoza kunyamula katundu malinga ndi zofuna za makasitomala. Specification Dielectric Withstanding Voltage: AC 500V Per Minute. Kukaniza kwa Insulation: 1000MΩ Min Contact Resistance: 100mΩ Max Kutentha Kusiyanasiyana: -20 ° C ~ + 80 ° C Zopangira Insulator: Thermoplastic

Titumizireni imelo Tsitsani ngati PDF

Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Kanema Wogwirizana

Ndemanga (2)

,,,

Bokosi labwino kwambiri la Solderless Breadboard - bolodi la mkate, 236-M, 2390 malo opangira mkate wopanda mafuta - Tsatanetsatane wa J-Guang:

Kufotokozera

Dielectric Withstanding Voltage: AC 500V Per Minute.

Kukaniza kwa Insulation: 1000MΩ Min

Kukaniza Kolumikizana: 100mΩ Max

Kutentha Kusiyanasiyana: -20°C ~ +80°C

Zakuthupi

Insulator: Thermoplastic

Zithunzi zatsatanetsatane wazinthu:

Zogwirizana nazo:
Mnzake wapanjinga waku Yorkshire wopirira yemwe adaphedwa ndi galimoto akufuna kuti achitepo kanthu pachitetezo cha pamsewu | 9 Pin D Sub cholumikizira
Mobile App idapangidwa kuti iwonetsetse kuyenda kotetezeka m'misewu yayikulu ku Pakistan | Sci-Tech | 9 Pin D Sub cholumikizira

Bokosi labwino kwambiri la Solderless Breadboard - bolodi, 236-M, 2390 malo osagulitsa mkate - J-Guang, Zogulitsazo zidzaperekedwa padziko lonse lapansi, monga: , , ,

9 Pin D Sub cholumikizira